Exclusive

Publication

Byline

Location

INTERNATIONAL PATENT: IDEC CORPORATION, IDEC株式会社 FILES APPLICATION FOR "CONNECTION STRUCTURE"

GENEVA, April 28 -- IDEC CORPORATION (6-64, Nishi-Miyahara 2-chome, Yodogawa-ku, Osaka-shi Osaka5320004), IDEC株式会社 (大阪府&#22... Read More


INTERNATIONAL PATENT: IRIS OHYAMA INC., アイリスオーヤマ株式会社 FILES APPLICATION FOR "AIR BLOWER"

GENEVA, April 28 -- IRIS OHYAMA INC. (12-1, Itsutsubashi 2-chome, Aoba-ku, Sendai-shi, Miyagi9808510), アイリスオーヤマ株式会社 ... Read More


INTERNATIONAL PATENT: IRIS OHYAMA INC., アイリスオーヤマ株式会社 FILES APPLICATION FOR "AIR BLOWER"

GENEVA, April 28 -- IRIS OHYAMA INC. (12-1, Itsutsubashi 2-chome, Aoba-ku, Sendai-shi, Miyagi9808510), アイリスオーヤマ株式会社 ... Read More


INTERNATIONAL PATENT: AUTONETWORKS TECHNOLOGIES, LTD., 株式会社オートネットワーク技術研究所, SUMITOMO WIRING SYSTEMS, LTD., 住友電装株式会社, SUMITOMO ELECTRIC INDUSTRIES, LTD., 住友電気工業株式会社 FILES APPLICATION FOR "WIRE HARNESS ROUTING STRUCTURE"

GENEVA, April 28 -- AUTONETWORKS TECHNOLOGIES, LTD. (1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie5108503), 株式会社オートネットワ&#12540... Read More


INTERNATIONAL PATENT: NISSHA CO.,LTD., NISSHA株式会社 FILES APPLICATION FOR "INTRAORAL ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME"

GENEVA, April 28 -- NISSHA CO.,LTD. (3, Mibu Hanai-cho, Nakagyo-ku, Kyoto-shi, Kyoto6048551), NISSHA株式会社 (京都府... Read More


INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES, LTD., 三菱重工業株式会社 FILES APPLICATION FOR "REFRIGERATION SYSTEM AND REFRIGERATION METHOD"

GENEVA, April 28 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京&#3... Read More


INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE"

GENEVA, April 28 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More


INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "OPTICAL PACKAGE AND METHOD FOR MANUFACTURING OPTICAL PACKAGE"

GENEVA, April 28 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More


INTERNATIONAL PATENT: NITERRA CO., LTD., 日本特殊陶業株式会社 FILES APPLICATION FOR "ELECTRODE AND ELECTRIC POWER STORAGE DEVICE"

GENEVA, April 28 -- NITERRA CO., LTD. (1-1-1, Higashisakura, Higashi-ku, Nagoya-shi, Aichi4610005), 日本特殊陶業株式会社 (愛知&#... Read More


INTERNATIONAL PATENT: NIPPON STEEL CORPORATION, 日本製鉄株式会社 FILES APPLICATION FOR "STAINLESS STEEL MATERIAL"

GENEVA, April 28 -- NIPPON STEEL CORPORATION (6-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008071), 日本製鉄株式会社 (東京都千&#20... Read More